Chinese manufacturers have been very interested in bringing out devices with a large amount of RAM. LeEco seems to want to be the first in everything and was even the first to use the Snapdragon 820 chipset. But now, it appears that the company has plans for a new device with a better chipset and it was spotted on a benchmark site.

Reporting on the latest chipset that was spotted on a device manufactured by LeEco, GSM Arena states that the chipset is the Snapdragon 823. It goes on to add that the chipset is alternatively known as the Snapdragon 821 and has not been used on any other smartphones that has launched until now. The Snapdragon 823 chipset is likely to be more powerful than the Snapdragon 820 that launched this year with a number of flagship handsets. This is one reason why the inclusion of the Snapdragon 823 chipset on the upcoming LeEco phone is drawing the attention of users and analysts alike.

When the upcoming LeEco phone was spotted, it was passing through the AnTuTu benchmark site, leading to its specifications being revealed and being picked up. The specifications pointed out that the chipset is listed as Qualcomm MSM8996pro, the Snapdragon 823's supposed model name. 

Also, as the device was making its way through AnTuTu, it scored 154,272. This was taken as further proof that the chipset onboard is the improved Snapdragon 823 and not the Snapdragon 820 which was used on the Le Max 2 and scored lower.

As for the other details, the device is likely to have a display with 1080p resolution. The main camera is expected to be a 16-megapixel version whereas the secondary camera is reportedly an 8-megapixel one. It is thought that its RAM will be in the region of 4 GB, however, there are also indications that this device will be released with several versions with different hardware and one of these will have 6 GB of RAM onboard.

With regards to the launch date of the upcoming device, it is likely to happen on June 29 when LeEco is scheduled to hold an event.